Advanced Packaging Module Development Engineer

Intel · US, Oregon, Hillsboro

Pay

$133,800 – $255,200 a year

Posted by employer

Sep 25, 2026

Sponsorship

Not stated

Found here

Sep 28, 2026

From the posting

Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and devel…

This description was written by Intel, not by HelloStamped. We show what the posting said and link you to it — we do not verify employers, and a listing appearing here is not a recommendation.