Packaging Module Development Engineer

Intel · US, Arizona, Phoenix

Pay

$133,800 – $188,890 a year

Posted by employer

Sep 17, 2026

Sponsorship

Not stated

Found here

Sep 20, 2026

From the posting

Job Details: Job Description: Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the f…

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