Substrate Packaging Research and Development Engineer

Intel · US, Arizona, Phoenix

Pay

$133,800 – $188,890 a year

Posted by employer

Sep 28, 2026

Sponsorship

Not stated

Found here

Sep 28, 2026

From the posting

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day…

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