Packaging Technology Development Graduate Intern

Intel · US, Arizona, Phoenix

Type

Internship

Pay

$120,898 – $120,902 a year

Posted by employer

Sep 14, 2026

Sponsorship

Not stated

Found here

Sep 18, 2026

From the posting

Job Details: Job Description: Intel is seeking a motivated Module Engineering Intern to join our dynamic semiconductor manufacturing team. In this role, you will support the development and implementation of manufacturing processes for sp…

This description was written by Intel, not by HelloStamped. We show what the posting said and link you to it — we do not verify employers, and a listing appearing here is not a recommendation.