Advanced Packaging Substrate Supplier Enablement Lead

Intel · US, Arizona, Phoenix

Pay

$164,100 – $231,670 a year

Posted by employer

Sep 22, 2026

Sponsorship

Not stated

Found here

Sep 23, 2026

From the posting

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As…

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