Director, Package Design Engineering

Renesas Electronics America · Dallas, TX

Posted by employer

Sep 26, 2026

Sponsorship

Not stated

Found here

Sep 26, 2026

From the posting

Responsibilities: Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs. Focus on design and de…

This description was written by Renesas Electronics America, not by HelloStamped. We show what the posting said and link you to it — we do not verify employers, and a listing appearing here is not a recommendation.