Packaging Module Development Engineer

Intel · US, Oregon, Hillsboro

Pay

$115,110 – $219,550 a year

Posted by employer

Sep 30, 2026

Sponsorship

Not stated

Found here

Today

From the posting

Job Details: Job Description: We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cr…

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