Advanced Packaging Dry Etch Module Development Engineer

Intel · US, Oregon, Hillsboro

Pay

$133,800 – $255,200 a year

Posted by employer

Sep 14, 2026

Sponsorship

Not stated

Found here

Sep 18, 2026

From the posting

Job Details: Job Description: We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch p…

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