Senior Advanced Packaging Defect Inspection Engineer

Intel · US, Oregon, Hillsboro

Pay

$115,110 – $219,550 a year

Posted by employer

Sep 25, 2026

Sponsorship

Not stated

Found here

Sep 28, 2026

From the posting

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology development and pathfinding programs. As packaging architectures grow increasing…

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